Quectel Wireless Solutions, a global IoT solutions provider, and MediaTek have announced that the globall ...
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Quectel’s RG620T 5G Module Hits Mass-Market Milestone with Adoption in Australia
Quectel’s RG620T 5G Module Hits Mass-Market Milestone with Adoption in Australia
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Fibocom Announces MediaTek-powered 5G RedCap Module FM330 Series to Lead 5G Expansion at MWC Barcelona 2024
Fibocom Announces MediaTek-powered 5G RedCap Module FM330 Series to Lead 5G Expansion at MWC Barcelona 2024
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Quectel introduces new ultra-low latency Wi-Fi 7 modules for PC OEMs
Quectel introduces new ultra-low latency Wi-Fi 7 modules for PC OEMs
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TCL launches the first 5G RedCap Dongle with Snapdragon® X35 5G Modem-RF System at MWC 2024
TCL launches the first 5G RedCap Dongle with Snapdragon® X35 5G Modem-RF System at MWC 2024
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Fibocom Announces the Compatibility of Three Mainstream Operating Systems of its High-end 5G Smart Module SC171 at MWC Barcelona 2024
Fibocom Announces the Compatibility of Three Mainstream Operating Systems of its High-end 5G Smart Module SC171 at MWC Barcelona 2024
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Quectel Unveils Four New High Performance Wi-Fi and Bluetooth Modules at MWC2024
Quectel Unveils Four New High Performance Wi-Fi and Bluetooth Modules at MWC2024
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Sequans at Mobile World Congress 2024: New products include 5G NR and 5G RedCap
Sequans at Mobile World Congress 2024: New products include 5G NR and 5G RedCap
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Quectel Announces RG255G MediaTek-Based Module to Drive 5G RedCap Preparations
Quectel Announces RG255G MediaTek-Based Module to Drive 5G RedCap Preparations
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Telit Cinterion Introduces the Latest 5G eMBB LGA Modules at MWC Barcelona 2024
Telit Cinterion Introduces the Latest 5G eMBB LGA Modules at MWC Barcelona 2024
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Sony Semiconductor Israel Announces Commercial Availability of the ALT1350 LPWA Chipset
Sony Semiconductor Israel Announces Commercial Availability of the ALT1350 LPWA Chipset