Quectel Wireless Solutions, a global IoT solutions provider, is pleased to announce the launch of the HCM511S high-performance MCU Bluetooth module for compact connected devices such as digital keys, portable devices and battery-operated motion sensors.

Utilizing Bluetooth Low Energy 5.4, the module accommodates an ARM Cortex-M33 processor and features built-in 32KB RAM and either 352KB or 512KB flash memory to deliver efficient performance.

The HCM511S module features excellent receiver sensitivity, a maximum transmit power of +6 dBm to achieve long distance transmission and has been designed to enable compact, low-power devices to connect cost effectively. Measuring just 16.6mm x 11.2mm x 2.1mm, the HCM511S is in the ultra-compact LCC form factor in order to optimize size and cost for end-products. Ideal applications for the HCM511S include sports & fitness devices, PC peripherals and accessories, healthcare applications including blood pressure and glucose metering, indoor navigation, digital key, connected lighting control and smart home and smart building applications.

“We’re delighted to bring the compact, high-performance HCM511S Bluetooth Low Energy MCU module to the market,” says Norbert Muhrer, President and CSO, Quectel Wireless Solutions.

“Everything from digital keys to barbecue thermometers, heart rate monitors and smart locks can be supported by the HCM511S. For battery-powered devices such as Bluetooth remote controls or electronic shelf labels, the high-power efficiency of the module will be an added benefit.”

Critically, the HCM511S module offers the option of support for Bluetooth mesh network low-power nodes. This enables increased network scalability and node counts over mesh topology, enabling greater device density to be enabled. The module offers up to 18 GPIOs which can be multiplexed for various interfaces including ADC, USART, I2C, I2S, SPI and PWM to maximize developer design options.

Connecting via a PCB Bluetooth antenna, the high-performance product operates in industrial grade operating temperature ranges of -40 °C to +85 °C and weighs just 0.57g. The HCM511S is certified for use in Europe, America, Canada, China, Australia and New Zealand and is also a certified Bluetooth product by the Bluetooth Special Interest Group.

The module also supports Secure Vault®, an enhanced secure engine for a higher level of IoT security. Quectel’s IoT modules are developed with security at the core. From product architecture to firmware/software development, Quectel incorporates leading industry practices and standards, mitigating potential vulnerabilities with third party independent test houses and have incorporated security practices like generating SBOMs and VEX files as well as performing firmware binary analysis into the entire software development lifecycle.

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Quectel Wireless Solutions, a global IoT solutions provider, is pleased to announce the launch of two new Wi-Fi and Bluetooth modules, the FCU741R and the FCS950R, along with two Bluetooth modules, the HCM010S and the HCM111Z.

This expansion of Quectel’s module portfolio aims to empower designers and developers with an expanded array of options, catering to diverse needs in terms of size, cost, and power efficiency. As a result, Quectel continues to demonstrate its commitment to meeting the evolving requirements of the IoT industry, providing innovative solutions for a variety of use cases.

“Adding the Quectel FCU741R, FCS950R and HCM010S to our portfolio enables developers and designers to select the module that best suits the needs of their use case,” said Norbert Muhrer, President and CSO, Quectel Wireless Solutions. “The combination of low power, efficient design, compact size and high-performance makes these modules ideal for many IoT use cases.”

The Quectel FCU741R is a high-performance Wi-Fi 4 module for wireless LAN connections that supports 2.4GHz and 5GHz frequencies to deliver a maximum data rate of 150Mbps. Measuring just 13.0mm x 12.2mm x 2.25mm the module has been designed to provide an optimal combination of size and cost for end products, making it ideal for size-sensitive applications. In addition, the module’s design minimizes design-in time and development effort, enabling faster time-to-market.

The module also offers an operating temperature range of -20 °C to +70 °C and a reliable USB2.0 interface. It supports two antenna designs, first generation RF coaxial connector and pin antenna interface with surface-mount technology (SMT) that makes the FCU741R an ideal option for durable and rugged designs.

The Quectel FCS950R is a Wi-Fi 5 and Bluetooth 4.2 module that can support a wide range of commercial applications thanks to its SDIO 3.0 interface which supports low power consumption and high-speed data transmission. The module is also compact, measuring just 12.0mm x 12.0mm x 2.35mm and weighs 0.58g. Offering support for IEEE 802.11a/b/g/n/ac, the FCS950R delivers a maximum data rate of up to 433.3Mbps in 802.11ac mode.

In common with the FCU741R, the FCS950R has been designed to address size-constrained deployments and its SMT technology makes it suitable for rugged designs. The module’s advanced package and the laser-engraved label achieve better heat dissipation and its indelible markings allow for large-scale automated manufacturing, which has a positive impact on cost and efficiency. The FCS950R also offers an operating temperature range of -20 °C to +70 °C.

Quectel has also launched the Quectel HCM010S, high-performance MCU Bluetooth module which boasts an ARM Cortex M33 processor and supports both Bluetooth Low Energy (BLE) and Bluetooth Mesh technologies. The module features built-in 64KB SRAM and 768KB flash, ensuring efficient performance. The HCM010S is provided in a LCC + DIP form factor with an ultra-compact size of 20.0mm × 15.6mm × 2.4mm.

Able to operate in temperatures from -40 °C to +105 °C, the Quectel HCM010S supports standard Bluetooth mesh network and is suitable for BLE devices that enable many-to-many communications for use cases in smart lighting, smart building and smart home wireless networks. The module also supports Tx power up to +20dBm for longer transmission range ensuring robust and reliable communication. Importantly, the module offers Secure Vault, an enhanced security option that features a higher level of IoT security.

Finally, the Quectel HCM111Z stands out as a high-performance MCU Bluetooth module, equipped with a Cortex-M3 processor running at a frequency of up to 48MHz. The module supports BLE 5.3, delivering an impressive maximum data rate of 2 Mbps. With built-in 48 KB SRAM and 512 KB flash, the module ensures efficient and reliable performance. The HCM111Z is equipped with a built-in Codec that enables microphone pickup and audio playback. This feature makes it well-suited for integration into smart devices such as voice-controlled remote controls, smart toy cars, sports and health gadgets, and home appliances.

Measuring a mere 15.0 mm × 12.0 mm × 2.25 mm in size, the HCM111Z is an ultra-compact Bluetooth module. It boasts support for up to 13 GPIOs, facilitating UART, SWD, SPI, I2C, ADC, PWM, and I2S functions within the QuecOpen® solution. Additionally, it features Bluetooth low power mode, enhancing flexibility and adaptability for various applications, particularly in smart homes and industrial IoT scenarios.

The post Quectel Unveils Four New High Performance Wi-Fi and Bluetooth Modules at MWC2024 appeared first on IoT Business News.

• WE310K6 module features the Realtek RTL8852BE chipset, 802.11 a/b/g/n/ac/ax, Bluetooth and Bluetooth Low Energy 5.2 for low power and high performance
• IEEE 802.11, Bluetooth SIG and Wi-Fi Alliance certifications eliminate the time and expense of developing and launching connected devices for consumer, medical, industrial and smart city applications

Telit Cinterion, a global enabler of the intelligent edge, today announced the WE310K6, a fully integrated, low-power module featuring dual-band, dual-stream Wi-Fi and dual-mode Bluetooth/ Bluetooth Low Energy.

The WE310K6 enables device OEMs to add high-speed wireless connectivity quickly and cost-effectively to their products — even when they have limited Bluetooth and Wi-Fi expertise.

The WE310K6 supports 802.11 a/b/g/n/ac/ax, classic Bluetooth and Bluetooth Low Energy 5.2, giving OEMs the flexibility to design products that can connect to other local devices or to the internet over Wi-Fi. The module is ideal for a wide variety of consumer and business applications, including:

• Smart home: home automation, appliances, home security and alarms, smart lighting, and IP cameras and speakers
• Health care and medical: remote patient monitoring, medical wearables, and health care and wellness devices
• Industrial and commercial: energy management, robotics, and industrial and building automation
• Other applications: aftermarket OEM telematics, fleet management, smart cities and parking, printers, asset management, pet and animal trackers, and more

The Realtek RTL8822BE-CG is a highly integrated single-chip that supports 2-stream 802.11ac solutions with Multi-user MIMO (Multiple-Input, Multiple-Output) and Wireless LAN (WLAN) PCI Express network interface controller and integrated Bluetooth 2.1/3.0/4.2 USB interface controller. It combines a WLAN MAC, a 2T2R capable WLAN baseband, and RF in a single chip. The RTL8822BE-CG provides a complete solution for a high-performance integrated wireless and Bluetooth device.

The WE310K6 also has IEEE 802.11 and Bluetooth SIG certifications and complies with Wi-Fi Alliance and Bluetooth SIG-v5.2 requirements. OEMs can get new products to market faster by reducing RF design time and removing the burden of testing and certification. The module’s other key features and benefits include:

• Two form factor options: LGA package or on top of an M.2 Key E carrier board
• Host-activated Wi-Fi and Bluetooth radios
• Dual-stream spatial multiplexing up to 1201 Mbps
• MU-MIMO technology
• Bluetooth Low Energy AUDIO Isochronous Channel (CIS) support
• Compatible with Wi-Fi 802.11 e, h, k and i
• Advanced security (including WPA3) with integrated crypto hardware
• Industrial-grade temperature range (-40 °C to +85 °C) to ensure reliability even in demanding environments

“We are thrilled to collaborate with Telit Cinterion and offer our latest generation Wi-Fi 6 solutions,” said Yee-Wei Huang, Realtek’s Vice President and Spokesman. “The collaboration yields a feature-rich platform with the latest cutting-edge technologies.”

“Wi-Fi 6 and Bluetooth Low Energy are rapidly becoming must-have features for consumer, enterprise, medical and industrial devices, but OEMs often face challenges in adding those technologies to their products,” said Marco Argenton, VP of Product Management for IoT Modules, Telit Cinterion.

“Our new WE310K6 enables them to add low-power quickly and cost-effectively, high-performance connectivity even when they have only limited RF design expertise. That means faster time to market and time to revenue and gives their customers peace of mind that the devices will work flawlessly from day one.”

The post New Telit Cinterion Wi-Fi 6/ Bluetooth® Low Energy Module Enables Rapid Development and Time to Market for Smart Devices appeared first on IoT Business News.

Quectel Wireless Solutions, a global IoT solutions provider, has launched its latest Quectel FCM360W Wi-Fi and Bluetooth module, combining a high-performance processor with Wi-Fi 6 and Bluetooth 5.1 capabilities.

With large memory including 512KB SRAM and 4MB of flash memory, the FCM360W is highly versatile, offering a blend of processing power, memory, connectivity and security.

The module features standard security features such as WPA-PSK, WPA2-PSK and WPA3-PSK security standards and provides 128-bit AES encryption for added security. The FCM360W supports multiple interfaces including UART, SPI, I2C, I2S, ADC and PWM alongside many low power consumption modes and keep-alive mechanisms, making it ideal for smart homes and industrial IoT (IIoT) use cases.

Quectel’s FCM360W module is offered in the LCC form factor with an ultra-compact package size of 25.5mm x 18.0mm x 3.2mm, providing great flexibility for developers. The module offers support for multiple interfaces across 19 GPIOs, allowing for multi-channel SSL connections and local caching of large amounts of data. This makes it ideal for use cases such as photovoltaic inverters, energy storage batteries and other smart devices that require long-term data monitoring and storage. Additionally, the module has an operating temperature range of -40°C to +85°C and comes with antenna options that include RF coaxial connector, external antenna pin or PCB antenna.

Norbert Muhrer, President and CSO, Quectel Wireless Solutions, said:

“We’re proud to launch the Quectel FCM360W to help enable a wide range of smart home and industrial IoT devices.”

“By bringing together Wi-Fi 6 and Bluetooth 5.1 in a compact form factor yet with a high-performance processor and large memory, we’re providing greater choices and flexibility for developers and device OEMs. With added support of QuecOpen and its powerful processing capabilities and array of interface options, the FCM360W is an excellent option for developers looking for a compact, versatile, and secure module for their IoT devices,” Mr. Muhrer continued.

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Atmosic’s wireless technology minimizes battery consumption and maintenance costs in connected devices.

Today Atmosic Technologies, an innovator in energy harvesting wireless platforms for the Internet of Things (IoT), and ETAG Tech, an leader in ultra-low power and high-performance electronic shelf labels (ESLs), today announced a partnership to bring Atmosic’s ultra-low power wireless solutions to ETAG Tech’s ESL portfolio.

ETAG Tech is using Atmosic’s ATM2 system-on-chips (SoCs) for several ESL designs and will be incorporating Atmosic’s ATM3 SoC in future designs to take advantage of energy harvesting technology.

David Su, CEO of Atmosic, said:
“By helping to solve the battery problems associated with electronic displays, we anticipate that ESLs will see much wider adoption across the retail industry and other sectors. Not only does Atmosic’s technology cut down on the cost of replacing batteries, but it also reduces the maintenance time needed for fleets of ESL display deployments.”

ETAG Tech selected Atmosic’s ATM2 series over a proprietary implementation since Atmosic’s solutions have best-in-class power savings. The ATM2 series is Bluetooth 5 standard-compliant and integrates Atmosic’s Lowest Power Radio technology to reduce power consumption low enough for ESLs and other connected devices to last years on a single battery, without needing replacement. ETAG Tech is also looking at deploying the ATM3 series in its next generation of ESL designs to take advantage of Atmosic’s Controlled Energy Harvesting technology, which can harvest energy from ambient light. The same SoC can also harness from other sources including radio, mechanical/kinetic motion, and even thermal sources to further reduce battery consumption. In some cases, Atmosic’s ATM3 series can enable devices to operate without any batteries at all.

Mr. Xia, CEO of ETAG Tech, said:

“Atmosic’s ultra-low power ATM2 SoC solution makes ESL products more robust in terms of interactivity and speed, in addition to removing the need for battery replacement. Atmosic’s technology is also easy to integrate into a range of ESL sizes and designs.”

Today ESLs are most popular in retail environments, but there are many industries where ESLs are useful including healthcare, manufacturing, enterprises, travel, and more. ESLs allow companies to update information in real-time and better manage inventory, without the hassle of constantly replacing paper signage and stickers. ESLs are also much cost-effective than LCDs and tablets, making ESLs ideal for environments where hundreds or even thousands might be on display in a store or other environment.

The post ETAG Tech Selects Atmosic’s Bluetooth Low Energy Solutions for its Electronic Shelf Label Portfolio appeared first on IoT Business News.

Telit today introduced the Bluetooth Low Energy (BLE) BlueMod+S50 single mode module.

This marks the industry’s first introduction of a standalone and certified, Bluetooth® 5 compliant module with a compelling mix of future-proof features designed to extend product lifecycles. Building on the success of the Telit BlueMod family of Bluetooth modules and complete integrated set of IoT products and services, the BlueMod+S50 is key to bringing low power, “connectionless” IoT designs and services to market quickly.

The new BlueMod+S50 module from Telit marks an industry milestone. Now, developers can adopt this cutting-edge technology into use cases not possible with previous generations of Bluetooth, such as full in-building connections. The latest Bluetooth 5 specification offers significant updates with quadruple range and speeds that are twice as fast, while increasing the capacity of connectionless data broadcasts by 800%. Always a step ahead, Telit incorporated additional features such as secure, integrated NFC (Near Field Communication) capability and support for most GATT based Client and Server profiles.

“What makes the BlueMod+S50 so compelling is the combination of industry’s latest silicon with Telit’s state of the art engineering for an overall richer, more intelligent user experience,” said Felix Marchal, Executive Vice President of GNSS and Short Range Wireless. “We take it a step further with our ‘design once, use anywhere’ philosophy by including resources from the Telit IoT Know How program—assisting customers holistically with deployment of completion solutions from idea to market.”

“The new module is not only swappable with previous generations of our Bluetooth line, it includes enhancements that benefit verticals which depend on advanced, forward-thinking technology like smart home and healthcare.”

Key Features and Benefits:

• Generic GATT Client and Server: Simplifies configuration
• Terminal I/O: Enables fast and reliable transport of data/ protocols transparently over Bluetooth
• NFC Handover: Eliminates manual interaction, delivering a nearly instant and most important—secure connection.
• Reliable line-of-sight range: over 800* meters. (*250m with Android phone and iPhone).
• Ultra-Low power: Proprietary UICP (UART Interface Control Protocol) further reduces power consumption of the module by 30-100 times compared to non UICP operations.

The BlueMod+S50 delivers industry-leading low power consumption and is well suited for many verticals including home automation, healthcare, telematics, asset management, routers and gateways, retail, and smart cities in addition to battery dependent devices with long product lifecycles. Designers can integrate the module without additional hardware via a robust choice of interfaces, including GPIO, ADC, UART, SPI, and others.

The new module is being fast tracked to address market demand for advanced, low-power wireless networking technology. It is the company’s latest addition to the Advanced Edge Technology portfolio that supports Bluetooth, Short range, GNSS, Wi-Fi, LoRa, and LPWA. As device makers are looking to develop IoT solutions that remain relevant for years to come, they are eager to adopt future-proof solutions. ABI Research forecasts Bluetooth-enabled device shipments over the next five years will increase by an average of half a billion per year through 2021, reaching more than five billion.

The post Telit Unveils Bluetooth 5 Module at Mobile World Congress 2017 appeared first on IoT Business News.

The new u‑blox JODY‑W1 module is ideal for infotainment and telematics applications.

u‑blox today announced the launch of JODY‑W1, a host‑based automotive‑grade module.

The new module enables real simultaneous dual band (RSDB) operation for faster, concurrent Wi‑Fi connectivity on the 2.4 and 5 GHz wireless bands.

As it also supports both dual‑band Wi‑Fi with 2×2 MIMO 802.11ac and dual‑mode Bluetooth (Bluetooth/Bluetooth low energy) 4.2, JODY‑W1 is ideal for in‑vehicle‑infotainment and telematics applications requiring high data rates and concurrent connectivity, such as in‑car hotspots, Wi‑Fi screens (e. g. Apple CarPlay) or video streaming across multiple clients.

RSDB enables a separation of time‑critical services requiring higher data rates from less critical services. In an infotainment application, the Wi‑Fi Screen could independently operate on the 5 GHz band, and the Wi‑Fi hotspot on the 2.4 GHz band, improving overall robustness and per‑band data rates in comparison to chipsets using time‑division multiplexing for dual‑band support.

Kilian Frank, Product Strategy, Short Range Radio Product Center at u‑blox, says:

“Thanks to RSDB support, JODY‑W1 offers best‑in‑class performance when operating as an access point, station, or in P2P mode on different bands in parallel. Combined with excellent Bluetooth and Wi‑Fi co‑existence, it is the ideal choice for applications with concurrent use‑cases.”

JODY‑W1 measures just 19.8 x 13.8 mm, making it one of the smallest modules on the market. It comes optionally with an integrated LTE filter for applications requiring LTE and Wi‑Fi antenna co‑location. The module complies with the highest automotive quality requirements. It contains an AEC‑Q100 compliant chip BCM89359 and it is manufactured according to ISO/TS16949, with automotive service level including PPAP, 8D report and full component traceability among others.

Fully tested engineering samples will be available in Q2 2017.

The post u-blox launches automotive Wi-Fi & Bluetooth module appeared first on IoT Business News.

Telit, today announced the commercial availability of its BlueMod+S42 Bluetooth 4.2 module, and two variants of the popular SL869 single and multi-standard positioning module family, the SL869-V3 and the SL869-ADR.

The BlueMod+S42 complies with the Bluetooth SIG v4.2 standard, which features critical upgrades, making Bluetooth low energy (BLE) applications faster, and more secure. This powerful high-end Bluetooth low energy module is an ideal solution for industrial applications such as electronic locking systems, lighting control, measuring, iBeacons; and for medical devices such as insulin pumps, hearing aids and wireless foot control.

The SL869-V3 and SL869-ADR are multi-constellation Global Navigation Satellite System (GNSS) receiver modules, each capable of tracking and using up to three constellations simultaneously to produce positioning, velocity and time information.

The use of multiple constellations provides advantages over previous GPS-only receiver modules, including improved accuracy and a handling of weak or blocked satellite signals. The SL869-V3 is intended for applications requiring autonomous navigation, while the SL869-ADR includes embedded support for automotive dead-reckoning (DR) using vehicle odometer and direction (forward or reverse) input signals. Automotive DR fills in calculated position and velocity information during gaps of satellite-based navigational which occur inside tunnels, large parking structures, or in city streets flanked by tall buildings. Automotive DR also enhances position accuracy when satellite-based fixes are available but are impacted by poor satellite signal receiving conditions.

Telit also announced that it is collaborating with Wirepas to deliver simple and easy to use intelligent IOT networks. Its BlueMod+S42 platform is the first to embed the groundbreaking Wirepas Connectivity technology, a decentralized radio communications protocol that eliminates the need for traditional repeaters making every wireless device, a smart router in the network.

“We are extremely proud to be a Telit partner, as the company is one of the true frontrunners in Industrial IoT. Our product, Wirepas Connectivity being integrated by Telit, delivers an autonomous, device network that has deterministic performance at any scale. Together with Telit we can help our customers connect their devices with 24/7 availability and to innovate in products and services,” said Teppo Hemiä, Wirepas CEO.

Felix Marchal, Executive Vice President of GNSS and Short Range Wireless, said:

“Earlier this year, Telit formed its Short-Range and GNSS business unit to deliver complete sensor-to-cloud or sensor-to-gateway-to-cloud solutions. These three modules and the partnership with Wirepas are great examples of what our new business unit will add to the Telit total IoT solution portfolio.”

“Telit now offers the most complete integrated set of IoT products and services – and unmatched IoT know-how – addressing the needs of the most demanding segments, such as automotive and industrial, on a global scale. The products we are launching here meet the stringiest Telit quality and robustness standards.”

Telit is also introducing new developer kits to enable rapid prototyping of solutions based on the new and upcoming modules. All three products follow the Telit tradition of excellence in radio-frequency (RF) design and performance in industrial-grade environmental conditions.

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Smallest Wireless System-on-Module Platform in the Market with Fully Pre-certified Dual-band Wi-Fi and Bluetooth Smart Ready Support Based on the new NXP i.MX 6UltraLite Processor.

Today, Digi International® announced the ConnectCore 6UL, a new embedded module platform delivering a connected System-on-Module (SOM) with integrated dual-band 802.11ac wireless LAN and Bluetooth 4.1 connectivity in a low-profile surface mount form factor slightly larger than a postage stamp.

Built on the new NXP i.MX 6UltraLite applications processor, the module is designed as an intelligent small footprint, low power embedded platform for highly cost-effective and reliable integration into connected devices without the traditional hardware or software design risk, allowing device manufacturers to focus solely on their core competency.

The module’s innovative and patent-pending Digi SMTplus surface mount form factor (29 mm x 29 mm x 3.75 mm) enables device manufacturers to optimize product designs by lowering cost and improving capabilities without compromising design flexibility. By providing two integration options (fully featured LGA, and simplified castellated edge vias) in one common form factor, it offers a scalable platform solution that addresses a wide range of product feature requirements, unit cost targets, and levels of design expertise. The surface mount form factor also provides highly reliable mounting for high shock/vibration applications and compact low-profile devices, and eliminates the need for costly board-to-board connectors.

Digi’s complete Linux Board Support Package (BSP) + software support deliver integrated, tested, regular software maintenance based on current, stable community releases. As part of the Linux software support, the new Digi TrustFence Device Security Framework offers the critical features required to protect today’s connected devices and applications, providing strong device security and peace of mind for device manufacturers and their customers. Digi TrustFence implements device security-relevant features such as secure connections, authenticated boot, encrypted data storage, access-controlled ports, secure software updates, and seamless integration of the dedicated on-module Secure Element (SE).

“The ConnectCore 6UL delivers on Digi’s leadership in embedded and wireless technology excellence by providing a connected product development platform with complete hardware and software support, including a strong embedded device security story,” said Mike Rohrmoser, director of product management, embedded systems at Digi International.

“Customers can now bring smart and secure connected devices to market at a fraction of the traditional time and effort, working with one strong partner, while focusing on their core competency without compromising design flexibility.”

Key features of the ConnectCore 6UL SOM platform include:

• NXP i.MX 6UltraLite applications processor : Cortex-A7 @ up to 696 MHz
• NXP PF3000 Power Management IC (PMIC)
• Independent on-module Cortex-M0+ Microcontroller Assist subsystem : Ultra-low power modes, watchdog, interface extension, custom applications
• Up to 2 GB reliable SLC NAND flash, and up to 1 GB DDR3
• Pre-certified 802.11a/b/g/n/ac + Bluetooth 4.1 (Smart Ready) option
• Integrated dual 10/100 Ethernet connectivity
• Dedicated, intelligent Secure Element (NXP)
• Ultra-compact, cost-effective, and reliable Digi SMTplus form factor (patent-pending) : Mounting options using 245-pad LGA or 76-pad castellated edge vias
• Linux BSP and software support, with full source code access : Including Digi TrustFence Embedded Device Security Framework
• Industrial operating temperature
• Long-term Digi product availability
• Strong 5-year Digi hardware warranty

“NXP provides an unrivaled portfolio of products supporting the incredible growth of smart, connected solutions. The ConnectCore 6UL System-on-Module platform demonstrates how long-term partners like Digi deliver best-in-class products built on our i.MX, Kinetis®, security and NFC products. NXP products are the trusted foundation of the Internet of Things (IoT) that our customers build on, now and in the future,” said Ron Martino, vice president, i.MX applications processor and advanced technology adoption, NXP Semiconductors.

Digi ConnectCore 6UL development kits will be available in two versions: The ConnectCore 6UL Starter Kit* available at $124 in August 2016, and the ConnectCore 6UL Jumpstart Kit* at $249 with expected availability in September 2016. Kits will be available from authorized Digi distributors.

Digi also offers additional go-to-market options to its customers through the Digi Wireless Design Services team, offering antenna design/selection guidance, cellular integration, certification assistance, as well as custom design services.

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Telit, a global enabler of the Internet of Things (IoT), today announced that it has agreed to acquire Bluetooth, Bluetooth Low Energy (BLE) and Near Field Communication (NFC) assets in hardware and software from Stollmann Entwicklungs und Vertriebs Gmbh (“Stollmann”) in Hamburg, Germany.

Stollmann is a global player in the Bluetooth and NFC business, designing, developing and manufacturing cutting-edge, low-power Bluetooth modules and highly sophisticated software solutions for short range wireless communications. Assets in acquisition include among others, Stollmann’s Bluetooth and NFC software stacks, ready-to-use modules and other intellectual property (IP) in wireless communications. Thirty-five Stollmann employees, mainly R&D engineers, are to be transferred to Telit.

The acquisition of the Stollmann assets represents another strategic step for Telit in its expanding vision of connecting an ever broader range of things to cloud. Industry analyst firm MarketsandMarkets estimates the global Bluetooth Smart and “Smart-Ready” market to be worth $5.6bn by 2020 with Bluetooth Smart shipments to surpass 1.2 billion units in five years, up from just 49 million units in 2013.

The integration of Bluetooth, BLE and NFC technologies into the Telit portfolio brings considerable consumer value as businesses are able to accelerate innovation based on Bluetooth and NFC, leveraging the full spectrum of enabling, synergizing elements from Telit, including cellular and GNSS modules, mobile network connectivity and IoT platform services. These ready-to-run hardware and service combinations will enable the enterprise to move quickly from idea to business with minimal effort or investment, bringing to market a much wider range of consumer solutions than would be possible otherwise.

“IoT devices are increasingly being integrated into every aspect of the consumer’s life, in application areas from health & wellness to retail and smart homes. The acquisition of these assets is a key development in the execution of our IoT vision of connecting enterprise edge assets – sensors and other remote devices – to the cloud using our tools such as the Telit IoT portal,” said Oozi Cats, Telit’s Chief Executive Officer.

“The IP we are acquiring will provide us with valuable expertise in additional short-range technologies including BLE, which is set to become the de-facto standard for local area and personal area IoT wireless connectivity. As one of the IoT’s fastest growing wireless technology areas, this IP will enable us to expand our market reach with a more comprehensive end-to-end connectivity solution.”

The post Telit Acquires Wireless Communications Assets to Boost Capabilities in Low-Power Internet of Things Market appeared first on IoT Business News.

ASR-1 module offers scalability and security for businesses’ cloud-connected products.

Today Afero, the IoT platform developer, in collaboration with Murata Manufacturing, announced its development of the ASR-1 module, the central computing device on which Afero is building a secure, end-to-end, Internet-of-Things (IoT) platform for the secure connection of every smart device.

The ASR-1 module is a Bluetooth® Smart system-in-package (SIP) that supports ultra-low power connectivity for data communication. It is well designed for Internet of Things (IoT) applications. Every ASR-1 comes with a security chip that is preprogrammed to operate in conjunction with the Afero Cloud.

The Afero tiny module chip allows developers, manufacturers, and service providers to host all connected devices on a single, secure platform. Murata’s global network of manufacturing facilities ensures that the chip will integrate seamlessly into the manufacturing processes of Afero customers and offers unprecedented abilities to scale production to meet business needs.

“Murata is the most trusted and reliable source of electronic components for the largest and most prominent companies in the world,” said Joe Britt, CEO of Afero. “Our collaboration shows their trust in our company, leadership, technology, and the value of our product and overall offering.”

Mehul Udani, General Manager, Connectivity Solutions, Murata Americas, stated:

“IoT enables a new breed of transformational products and also demands transformational tools.”

“We are excited to collaborate with Afero, whose turnkey platform for secure IoT communication gives our customers the ability to create new and better experiences.”

Accelerating the Reality of IoT Connected Products
Afero provides companies and developers a comprehensive platform that encompasses the three key building blocks for all connected devices: the product, the mobile application, and scalable cloud services. Together, these building blocks allow companies and developers to deliver innovations to the marketplace faster by reducing complexity and by providing a secure connection between devices and trusted data in the cloud.

Afero was built with security as a cornerstone. The platform provides mutual authentication so that all incoming and outgoing data is continuously encrypted and never exchanged without proven identity. The team built Afero to address the problem of a rapidly growing and fragmenting smart device industry.

For more information on Afero and its IoT platform solution, go to www.afero.io.

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u-blox, a global leader in wireless and positioning modules and chips, announces the EMMY-W1 series of multiradio modules for easy, reliable implementation of in-car hotspots, rear seat entertainment, hands-free telephony, rear view camera communications, graphical user interface (GUI) mirroring with simple pairing and other automotive short-range connectivity applications.

The EMMY-W1 series combines high speed Wi-Fi 802.11ac/a/b/g/n and dual-mode Bluetooth v4.1 (Bluetooth Smart Ready). In addition it offers user-friendly near field communication (NFC) pairing. The dual-band Wi-Fi (2.4 GHz & 5 GHz), dual-mode Bluetooth ensures the widest possible connectivity with any mobile device. One module variant integrates an LTE co-location filter that permits the device’s Wi-Fi antenna to be positioned close to an LTE cellular radio antenna, for example in the same ‘shark fin’ antenna housing, enabling external Wi-Fi connectivity.

EMMY-W1 modules, measuring 13.8 mm x 19.8 mm x 2.5 mm, are qualified to VW 80000/ISO 16750-4, and have European, US, and Canadian certifications. They feature best-in-class radio performance and operate from -40 °C to +85 °C ambient.

Engineering samples and development kits are available now. The modules will be in volume production in Q3 2015.

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u-blox, a global leader in wireless and positioning modules and chips, announces full production availability of the ELLA-W1 series of compact, automotive-grade, multiradio modules.

The modules promise predictable, reliable results and easy implementation of in-car wireless connectivity. Applications include hands-free telephony, in-car hotspots, rear view cameras and graphical user interface (GUI) mirroring.

ELLA-W1 is a series of ultra-compact, host-based, short-range transceiver modules offering both simultaneous and independent communications over Wi-Fi 802.11a/b/g/n, Bluetooth V3.0 + HS and Bluetooth V2.1 + EDR. Each module has an integrated MAC, baseband processor and RF front end, and connects to its host via an SDIO 2.0 interface. The dual-band Wi-Fi versions (2.4 GHz and 5 GHz) minimize interference problems from the crowded 2.4 GHz band. The modules operate simultaneously in client (STA) and access point (AP) mode, the latter enabling up to 8 Wi-Fi clients to be connected concurrently.

The ELLA-W1 is a surface-mount module with a 14.8 mm x 14.8 mm footprint and 2.5 mm height. ELLA-W1 modules feature best-in-class radio performance, an operating temperature range of -40 °C to +85 °C, automotive qualification to VW 80000/ISO 16750-4, and European, US, and Canadian certifications.

Engineering samples and development kits are available now.

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Blue Gecko Modules, SoCs, Development Kit and Software Stack Provide Easy On-Ramp to Ultra-Low-Power Wireless Connectivity.

Silicon Labs, a leading provider of wireless connectivity solutions for the Internet of Things (IoT), today unveiled a complete Bluetooth® Smart solutions portfolio designed to help developers minimize the energy consumption, cost and complexity of wireless IoT designs. Silicon Labs’ recent acquisition of Bluegiga, a leading supplier of wireless modules and software, accelerates the company’s ability to deliver comprehensive Bluetooth Smart solutions.

Silicon Labs’ new Blue Gecko solutions include ultra-low-power wireless system-on-chip (SoC) devices, embedded modules, and Bluegiga’s software development kit (SDK) and Bluetooth Smart software stack. Blue Gecko wireless SoCs and modules help developers simplify design and speed time to market for a wide range of applications for the connected home, health and fitness, wearables, automotive, consumer electronics, audio and industrial automation markets.

The Blue Gecko portfolio addresses the largest, fastest-growing low-power wireless connectivity opportunity in the IoT market. According to IHS Technology, Bluetooth Smart will represent 42 percent of the total low-power wireless module and chipset market by unit volume in 2018. A significant number of Bluetooth Smart chipsets are currently used in wireless modules to meet the needs of low-volume IoT applications, greatly simplifying RF design.

By the end of the decade, the use of cost-effective Bluetooth Smart chipsets and wireless SoCs is expected to outpace modules as many IoT applications reach higher volumes. Silicon Labs’ Blue Gecko portfolio provides developers with the flexibility to begin development with modules and transition to SoCs when needed with little to no system redesign.

James Stansberry, senior vice president and general manager of IoT products at Silicon Labs, said:

“Our new Blue Gecko portfolio gives developers a rapid on-ramp to the IoT, enabling them to bring Bluetooth Smart-enabled products to market quickly while maintaining their investments in tools and software as they migrate from modules to chips for later production.”

“Our Bluegiga acquisition provided a best-of-breed scripting language and protocol stack that we’re leveraging in our Blue Gecko portfolio, making it easy to add Bluetooth Smart connectivity to countless IoT applications.”

Blue Gecko Wireless SoCs

The first in a family of wireless SoCs optimized for IoT applications, Blue Gecko SoCs combine Silicon Labs’ energy-friendly EFM32® Gecko MCU technology with an ultra-low-power Bluetooth Smart transceiver. This innovative, single-die solution provides industry-leading energy efficiency, the fastest wake-up times, superior RF sensitivity and no-compromise MCU features combined with the Bluegiga Bluetooth Smart software stack to help developers reduce system power, cost and time to market. Unlike other Bluetooth Smart IC alternatives, a Blue Gecko SoC can transmit +10 dBm or higher output power with its fully integrated power amplifier and balun, further reducing design complexity.

Blue Gecko SoCs are based on the ARM® Cortex®-M3 and M4 cores and offer 128 to 256 kB flash sizes and 16 to 32 kB RAM sizes. The SoCs integrate an array of low-energy peripherals as well as Silicon Labs’ Peripheral Reflex System (PRS) for autonomous peripheral operation. The Blue Gecko SoC family also offers a roadmap of enhanced flash and RAM memory sizes and additional package options to meet future application needs.

Blue Gecko Wireless Modules

Bluegiga modules based on Blue Gecko SoCs are designed to help developers accelerate time to market and reduce development costs and compliance risks by providing a pre-certified, plug-and-play RF design.
Bluegiga Bluetooth Smart modules incorporate all features of Blue Gecko SoCs and are certified for use in all key markets including North America, Europe, Japan and South Korea.
Bluegiga modules include the Bluegiga Bluetooth Smart software stack and profile toolkit and come with 256 kB flash and 32 kB RAM, providing ample available memory for onboard applications. Flexible hardware interfaces enable easy connection to a variety of peripherals and sensors, and an integrated antenna makes RF operation consistent and straightforward for the design engineer.
Bluegiga Bluetooth Smart modules provide very low power operation, enabling wireless system designs to be powered from a standard 3 V coin cell battery or two AAA batteries.

Simplifying Bluetooth Smart Development

To simplify wireless development, Silicon Labs offers the complete Bluegiga Bluetooth Smart software stack for Blue Gecko modules and wireless SoCs. The stack implements the Bluetooth Smart protocol layers including the Attribute Protocol (ATT), the Generic Attribute Profile (GATT), the Generic Access Protocol (GAP), a security manager and connection management.

The Blue Gecko portfolio includes a comprehensive wireless SDK for developing Bluetooth Smart applications using either a host or fully standalone applications through the easy-to-use Bluegiga BGScript scripting language. BGScript enables developers to create applications quickly without using external MCUs to run the application logic, enabling them to reduce cost, simplify their designs and get to market faster. Bluetooth Smart application profiles and examples are also available to help streamline development.

Pricing and Availability

Samples of Bluegiga modules based on Blue Gecko SoCs are planned to be available in late Q2 2015. Samples of Blue Gecko wireless SoCs are planned to be available in early Q3 in a choice of 5 mm x 5 mm QFN32 and 7 mm x 7 mm QFN48 packages. Pricing for Blue Gecko-based Bluegiga modules begins at $4.99 in 10,000-unit quantities. Blue Gecko SoC pricing begins at $0.99 in 100,000-unit quantities. The Bluegiga SDK and Bluetooth Smart software stack will be available to Silicon Labs’ customers at no charge.

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The versatile ODIN-W262 module is ideal for both point-to-multipoint cable replacement and IoT applications that need advanced multiradio capabilities.

u-blox, a global leader in wireless and positioning modules and chips, announces ODIN-W262, a new stand-alone multiradio module designed for Internet-of-Things applications. The professional-grade (-40 °C to +85 °C) module makes adding wireless connectivity to any product quick and easy, with the added benefit that it is radio type-approved in countries across the world. A robust, built-in antenna provides flexibility with respect to the module’s installed position and orientation. Applications include cable replacement running in Wireless Multidrop and Extended Data Mode for advanced multipoint operation with several radios operating simultaneously.

ODIN-W262, measuring only 14.8 mm x 22.3 mm x 4.5 mm, needs no external host. It is ready-to-use and comes complete with embedded driver, stack and application for wireless data transfer. The module supports multiple concurrent Wi-Fi (2.4 GHz and 5 GHz), Classic Bluetooth and Bluetooth low energy (v4.0) links to provide the greatest flexibility possible, and it is easily configured using AT-commands.

Future firmware upgrades will add micro access point, high-speed interfaces (such as RMII) and support for custom embedded applications. For example, the module will be able to act as a Wi-Fi access point or as a gateway between Wi-Fi and Bluetooth low energy sensors.

These numerous configuration options minimize inventory requirements and reduce design effort and costs because one module can be software-configured for use in a variety of products. For example, a manufacturer may want to offer products in either Wi-Fi or Bluetooth versions.

Herbert Blaser, u-blox’ Head of Product Center Short Range Radio, comments:

“Concurrent Wi-Fi and Bluetooth has many uses. In retail applications, Bluetooth low energy may be used to detect the closest printer while data is sent to that printer over Wi-Fi or Bluetooth classic. There are potential medical applications too. A patient monitoring device may be supervised via Wi-Fi at a central location in the hospital, while local communication with nurses is carried out over Bluetooth. For such medical applications, the module complies with the IEC 60601-1-2 standard.”

The EVK-W262U is an evaluation kit for the module. It uses a single USB connection for data and power and comes complete with the u-blox configuration tool for Windows. For applications where an external antenna may be optimal, u-blox offers the ODIN-W260 module, which is a version with U.FL antenna connectors.

Samples and evaluation kits will be available in April 2015.

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Company Is Now a One-Stop-Shop for Wireless ICs, Modules, Software and Solutions for the Internet of Things.

Silicon Labs, a leading provider of microcontroller, wireless connectivity, analog and sensor solutions for the Internet of Things (IoT), today announced the acquisition of Bluegiga Technologies Oy. A privately held company based in Espoo, Finland, Bluegiga is one of the fastest growing independent providers of short-range wireless connectivity solutions and software for the IoT. Bluegiga’s wireless portfolio includes ultra-low-power Bluetooth® Smart, Bluetooth Classic, and Wi-Fi® modules, as well as software stacks, development tools and software development kits (SDKs) for a multitude of applications in the industrial automation, consumer electronics, audio, automotive, retail, residential, and health and fitness markets.

This strategic acquisition significantly expands Silicon Labs’ wireless hardware and software solutions for the IoT. Bluegiga’s market-proven Bluetooth and Wi-Fi modules, software stacks and development tools complement Silicon Labs’ 802.15.4 ZigBee® and Thread mesh networking software, ultra-low-power sub-GHz solutions, and wireless MCU and transceiver product offerings. The combined wireless connectivity portfolio and development ecosystem will enable Silicon Labs to address a broader range of market opportunities and customer needs. Together, Silicon Labs and Bluegiga offer customers a “one-stop-shop” source of standards-based wireless connectivity solutions including high-performance, long-range and ultra-low-power options.

“With Silicon Labs’ wireless, microcontroller and sensor portfolios gaining considerable traction in the IoT markets, the timing of this acquisition couldn’t be better,” said Tyson Tuttle, CEO of Silicon Labs. “Bluegiga’s wireless modules and software stacks round out our wireless portfolio and complement our IoT solutions. The addition of Bluegiga wireless modules gives us new ways to deliver simplicity to our customers, enabling developers to easily add wireless connectivity to their designs.”

Following the acquisition, Silicon Labs will continue to operate in Espoo, Finland, as a center of excellence for wireless hardware and software technology development. The company will continue to develop, market and support a complete portfolio of Bluetooth and Wi-Fi module products and software stacks for customers worldwide.

“The Bluegiga team is excited to join forces with Silicon Labs,” said Riku Mettälä, vice president of product creation at Bluegiga.

“We truly share a common vision of enabling versatile, cost-effective and streamlined wireless connectivity solutions for a wide range of applications, from the connected home to industrial IoT to consumer and health and fitness devices. Together, our wireless development teams will drive innovation in the IoT market, and our unified solutions will give customers a rich choice of wireless platforms for connected devices.”

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Rugged ODIN-W160 supports dual-band Wi-Fi & dual-mode Bluetooth for reliable connectivity.

Swiss u-blox, a global leader in wireless and positioning semiconductors and modules, announces the ODIN-W160, a rugged multiradio module for demanding industrial, vehicle, medical, and security applications.

Herbert Blaser, VP of Short Range Radio at u-blox, says:

“u-blox’ compact ODIN-W160 module is perfect for small sensor applications in rugged environments, where faultless operation 24/7 is a requirement. With this module, u‑blox customers can shorten their product development cycle significantly by integrating a robust, certified communication solution in their IoT applications.”

ODIN-W160 supports dual-band Wi-Fi 2.4/5GHz (U-NII bands 1, 2, 2e, 3), as well as dual-mode Bluetooth v4.0, which includes Bluetooth low energy and Classic Bluetooth (Bluetooth “Smart Ready”).

The host-based module is designed for a long life cycle, which makes it ideal for infrastructure, building, and automotive implementations. In addition, it extends battery life operation due to its ultra-low power consumption.

Together with the open-source Linux host driver, the 15 x 22 x 3 mm module minimizes development time to implement short range wireless communications in end-devices. Also, no trimming or tuning is required during manufacturing of customer end-devices, since ODIN-W160 has pre-calibrated radio parameters and MAC address stored in on-board EEPROM.

ODIN-W160 is in a castellated package, improving visual inspection of end-devices, and comes with a u.fl antenna connector for a wide selection of certified antennas.

It provides modular radio type approvals for Europe, USA, and Canada (R&TTE, FCC, IC), EMC certification, and Bluetooth qualification.

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